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Flexible Electronics News

New Production Equipment Supports Vizinex RFID’s Growth

Vizinex doubled its production capacity with a second flip-chip bonder line.

Vizinex RFID recently added two new pieces of production equipment to its Bethlehem, Pennsylvania, facility. The new equipment supports Vizinex’s growth due to demand for RFID tags, and streamlines the company’s operations.

Vizinex doubled its production capacity with a second flip-chip bonder line. It recently in-stalled a Datacon Flip-Chip Die Bonder, which doubles Vizinex’s capacity for RFID tag manufacturing.

Vizinex also invested in a Schunk Intec router/saw for cutting the circuit boards the com-pany uses to make its RFID tags. The high-speed router/saw, which replaces a saw its team designed in-house years ago, significantly reduces the time to cut a circuit board.

“Our business is up significantly this year, especially the demand for RFID tags from the rental industry,” says Ken Horton, co-founder and CEO, Vizinex RFID. “Companies are re-alizing how much money they can save doing asset tracking with RFID. The extra flip-chip bonder machine and our new router/saw are helping us meet the growing demand for off-the-shelf and custom RFID tags.”

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